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RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB

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RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB

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Brand Name : ABIS

Model Number : ABIS-0006

Certification : RoHS UL

Place of Origin : China

Board thickness : 0.2-3.0mm

Copper thickness : 1/2OZ 1OZ 2OZ 3OZ

Base material : FR-4,FR-4/aluminum/ceramic/cem-3/FR-1

Min. line spacing : 0.1mm4mil),0.2mm

Min. line width : 0.075mm/0.075mm(3mil/3mil)

Min. hole size : 0.20mm,0.3MM,0.02mm

Surface finishing : Immersion Gold

Product name : AC110V 220V Infared Led Pcb Board,custom Single Sided FR1 PCB Manufacturer in China

Application : Consumer Electronics,electronic products

Solder mask : green,red

Layer : 1~20 layers,1-24 layer

Silkscreen color : White or on your request.,Black.white.yellow.red.blue,White/black/yellow/red/blue

Color : Customized Color,Blue on your request

Solder mask color : blue,White.Black.Yellow.Green.Red.Blue,Green/blue/black/red/yellow/white

Standards : IPC-A-610 E Class II-III,IPC 6021 Class 2

Number of layers : 1-8 layers pcb,2/4/6/8/10/12 Layers

Service : One-stop service,PCB Manufacturer service

Type : SMD LED,custom Single Sided FR1 PCB Manufacturer in China

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HDI High Tg PCB Circuit Board Multilayer Buried and Blind Via Holes PCB with RoHS UL

ABIS CIRCUITS CO., LTD

Created in 2006,as a long history China based PCB supplier, ABIS manufactures different kinds of printed circuit boards, including MCPCB,CEM-1,CEM-3,and FR4,FR-4 high Tg, Rogers, Teflon, Arlon ets special material.
ABIS has set up two PCB factories in China: one for MCPCB producing, quick turn and small volumn making, and another for mass production. Currently, ABIS modern plants occupy total 10000 s.q.m facility, with more than 1100 stable and experienced workers. Professionalism and continuous optimization of manufacturing processes have positioned ABIS as a reliable and favorite partner for global companies.

Specification

Model No.

ABIS-0006

Base Material

copper

Insulation Materials

Epoxy Resin

Model

FR-4

Copper Thickness

10z

surface Finishing

Enig

solder Mask Type

Green

silkscreen

white

Board Thickness

1.6mm

Min.Hole Size

0.2mm

Min.Line Width/Space

0.1mm

Test

Flying Probe and Fixture

Package

Vacuum Package

Certificates

UL,ROHS,,ISo9001

Trademark

xJY/OEM

Specification

Normal

origin

china

Hs Code

853400900


. PCB Factory II (Mass production& HDI)

Item Capacity
Raw material CEM1, CEM3, FR1 FR4, Rogers, Teflon, etc.
Layer 1 Layer-20 Layer
Min.Line width/space 3mil/ 3mil (0.075mm/0.075mm)
Min.hole size 0.1mm(drilling hole)
Max. Board size 1200mm* 600mm
Finished board thickness 0.2mm-6.0mm
Cooper foil thickness 18um- 280um (0.5oz-8oz)
NPTH Hole Tolerance +/- 0.075mm
PTH hole Tolerance +/-0.05mm
Outline tolerance +/-0.13mm
Surface finished Lead-Free HASL, immersion gold(ENIG), Immersion silver, OSP, gold plating, gold finger, Carbon INK
Impedance Control Tolerance +/-10%
Production capability 50,000 s.q.m/ month

Logistics Service

RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB

On time delivery rate is more than 95%

1.24 hours fast turn for double side prototype PCB, 48 hours for 4-8 layers prototype PCE.
2.1 hour for quotation 2 hours for engineer question. Complaint feedback within 2 hours.
3.7-24 hours for order service.
4.7-24 hours for technical support.
5.7-24 hours manufacturing operations.
Go Green !
Our Plant have invested huge money for the waste water and exhaust gas process to reduce thepollutant emission, Through survey and investigation, we decided to adopt environment-friendly andenergy-efficient technologies and techniques to our plants.
The above mentioned, the application of technologies and techniques as described below indicatesthat Core indeed assumed its social responsibility of environment protection, by green production andreducing pollution and carbon emission.

Product Tags:

High Tg Blind Via PCB

      

HDI Multi Layer PCB

      

High Tg Multi Layer PCB

      
China RoHS UL HDI High Tg Buried And Blind Via Holes Multi Layer PCB factory

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